MOHON TANYAKAN KETERSEDIAAN STOK SEBELUM MEMBELI
8GB 1Rx8 1G x 72-Bit PC4-2666 CL19 288-Pin DIMM//
Kingston's KSM26ES8/8MR is a 1G x 72-bit (8GB) DDR4-2666
CL19 SDRAM (Synchronous DRAM), 1Rx8, ECC, memory module,
based on nine 1G x 8-bit FBGA components. The SPD is
programmed to JEDEC standard latency DDR4-2666 timing of
19-19-19 at 1.2V. Each 288-pin DIMM uses gold contact fingers.
FEATURES
Kingston's KSM26ES8/8MR is a 1G x 72-bit (8GB) DDR4-2666
CL19 SDRAM (Synchronous DRAM), 1Rx8, ECC, memory module,
based on nine 1G x 8-bit FBGA components. The SPD is
programmed to JEDEC standard latency DDR4-2666 timing of
19-19-19 at 1.2V. Each 288-pin DIMM uses gold contact fingers. The
electrical and mechanical specifications are as follows:
CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh
Command Time (tRFCmin)
Row Active Time (tRASmin)
Maximum Operating Power
UL Rating
Operating Temperature
Storage Temperature
19 cycles
45.75ns(min.)
350ns(min.)
32ns(min.)
• Power Supply: VDD = 1.2V Typical
• VDDQ = 1.2V Typical
• VPP = 2.5V Typical
• VDDSPD = 2.2V to 3.6V
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• Low-power auto self refresh (LPASR)
• Data bus inversion (DBI) for data bus
• On-die VREFDQ generation and calibration
• Single-rank
• On-board I2 serial presence-detect (SPD) EEPROM
• Temperature sensor with integrated SPD
• 16 internal banks; 4 groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Fly-by topology
• Terminated control command and address bus
• PCB: Height 1.23” (31.25mm)
• RoHS Compliant and Halogen-Free